Surface Mount Technology (SMT) is a technology of soldering electrical components onto the pre-printed circuit boards. In order to make the whole process possible, SMT reflow soldering oven is usually used. This is a machine that employs high level of technology and bonding principles in its functionality. It is very complex but offers reliability and better alternative in the field of electrical assembly. This comes with advantages such as reduced board cost, controlled manufacturing and assembling process and reduced material handling.
The reflow soldering is the process of joining electronic devices to the printed circuit boards as the contact pads. This requires the use of solder paste and heat to attach the components. It is the SMT reflow soldering oven that is best in this. It allows for better control of heating process that minimizes chances of defective components.
It all starts by making of solder paste. This is a mixture of small solder particles, flux and some solvent that also work as a cleaning agent. This forms a sticky substance that is used to loosely attach electrical components on to specific points on the circuit board.
SMT soldering ovens are designed with specific zones, stages which numbers to a total of four. It all starts from the preheat zone. In this stage, the melting temperature of the solvent in paste is set. The time/temperature relationship also known as ramp is determined to help control heating in other zones.
The second zone is the thermal soak zone. Removal of paste volatiles takes place here through a 60 to 120 second heat exposure of the PCB at a predetermined temperature. This is followed by the reflow stage, the stage in which the whole thing happens. Printed circuit board and components are exposed to the highest possible temperatures. The tolerable (liquidus) temperature for each of the component is determined and the maximum temperature is set just below it. This forces reduction between the surface tension between solder particles so that they melt at the point of contact on the pad.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
The heaters in these types of oven are made of ceramic materials with various options through which heat reaches the heating zones. The heat transfer can either be through hot air (radiation) and infrared electromagnetic radiation among other alternatives.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
In order to remain relevant in electrical assembly industry, just like any other industry, it is important to use highly efficient and most up-to-date technology. There are latest models SMT reflow soldering oven that offers efficiency level that results to high productivity and profitability to a firm.
The reflow soldering is the process of joining electronic devices to the printed circuit boards as the contact pads. This requires the use of solder paste and heat to attach the components. It is the SMT reflow soldering oven that is best in this. It allows for better control of heating process that minimizes chances of defective components.
It all starts by making of solder paste. This is a mixture of small solder particles, flux and some solvent that also work as a cleaning agent. This forms a sticky substance that is used to loosely attach electrical components on to specific points on the circuit board.
SMT soldering ovens are designed with specific zones, stages which numbers to a total of four. It all starts from the preheat zone. In this stage, the melting temperature of the solvent in paste is set. The time/temperature relationship also known as ramp is determined to help control heating in other zones.
The second zone is the thermal soak zone. Removal of paste volatiles takes place here through a 60 to 120 second heat exposure of the PCB at a predetermined temperature. This is followed by the reflow stage, the stage in which the whole thing happens. Printed circuit board and components are exposed to the highest possible temperatures. The tolerable (liquidus) temperature for each of the component is determined and the maximum temperature is set just below it. This forces reduction between the surface tension between solder particles so that they melt at the point of contact on the pad.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
The heaters in these types of oven are made of ceramic materials with various options through which heat reaches the heating zones. The heat transfer can either be through hot air (radiation) and infrared electromagnetic radiation among other alternatives.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
In order to remain relevant in electrical assembly industry, just like any other industry, it is important to use highly efficient and most up-to-date technology. There are latest models SMT reflow soldering oven that offers efficiency level that results to high productivity and profitability to a firm.
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